A few weeks ago, we mentioned that MediaTek has dethroned Qualcomm as the largest supplier of smartphone chips. For many years, Qualcomm has been the leader in this industry, but MediaTek’s numbers have been on the rise since last year. It has been working on a number of new products such as the MediaTek M80 5G modem, the 6nm Dimensity 1200 premium 5G chipset, and the Dimensity 700 5G SoC. Some of the major OEMs have started using MediaTek, including OnePlus, Honor, OPPO, and iQOO. Last year, we heard that you were seeking permission to be able to supply Huawei.
The latest from the company is the MediaTek Dimensity 900 5G chipset. It’s based on a 6nm process and can support premium specs like a 108MP main camera, FHD + 120Hz displays, and Wi-Fi 6 connectivity.
MediaTek Wireless Communications Business Unit, Corporate Vice President and General Manager saying the chipset offers a “set of connectivity, display and 4K HDR visual enhancements for high-end 5G smartphones “. The chipset also allows brands flexibility in the design of their 5G lineup. It comes with a 5G New Radio (NR) sub-6GHz modem and is capable of supporting up to 120MHz of bandwidth.
The chip allows carrier aggregation. It also comes with two Arm Cortex-A78 processors (up to 2.4GHz) and six Arm Cortex-A55 cores (up to 2GHz). It can support UFS 3.1 storage and LPDDR5 memory, as well as a 120Hz screen refresh rate. Other important features include Arm Mali-G68 MC4 GPU, AI Processing Unit (APU), HDR Native Image Signal Processor (ISP), MediaTek’s MiraVision, 5G Dual-SIM Standby, and HyperEngine Game Engine. The new devices to be introduced starting this second quarter will already run on the MediaTek Dimensity 900.
This Dimensity chipset already supports 2G to 5G connectivity, Independent (SA) and Non-Independent (NSA) 5G architectures, Voice over New Radio (VoNR), True Dual SIM 5G (5G SA + 5G SA), Dynamic Spectrum Sharing (DSS) , time division duplex (TDD) and aggregation of two 5G carriers (2CC) via frequency division duplex (FDD).